Disco
Disco makes dicing saws and laser saws to cut semiconductor wafers, grinders to thin silicon and compound semiconductor wafers, and polishing machines to remove the grinding damage layer from the wafer back-side.
PrivateJapanTools, EDA & IP
Disco makes dicing saws and laser saws to cut semiconductor wafers, grinders to thin silicon and compound semiconductor wafers, and polishing machines to remove the grinding damage layer from the wafer back-side.
PrivateJapanTools, EDA & IP